Hi Rehan,
many thanks for this information. I was not aware of the fact that you could import stackups in PCB as of VX.1
I have tried it a little bit and I see the same limitation that is keeping PCB and simulation stackup separate, as described above.
In PCB you have the limitation that only one insulation layer can be used between metal layers, and metal layers can not have metallization.
If you try to import a detailed Hyperlynx stackup into PCB it will generally either fail with an error (if there are more prepregs) or import the wrong thickness of the metal layer and change the total thickness of the board. (See SR 2697221818)
This problem has been addressed with idea D12505 "Improve Expedition to allow to have more prepregs between copper layers" (please do support this idea by voting for it).
Using this utility you still have to have two separate stackups. One for simulation and documentation for production and the other for designing the PCB. And this was the original question of this thread. Which stackup is the "correct one?" The answer is both.
Bye
Matija